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Solderless Breadboard with 830 tie points total: 630 tie-point IC-circuit area plus two 100 tie-point distribution strips providing 4 power rails

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This 6.5 x 2.125 solderless breadboard has four bus lines each spanning the length of the board, and 63 rows of pins, enough for up to nine 14-pin

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830 tie points total: 630 tie-point IC-circuit area plus two 100 tie-point distribution strips providing 4 power rails. White ABS plastic body with

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Premium solderless breadboard — ideal for testing, prototyping, and experimentation 840 tie points total: 200 in 2 power rails, 640 in a 64 × 10

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