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2 Pieces Thermal Silicone Heat Sink Compound 0.671W/m.K for Processor CPU

2 Pieces Thermal Silicone Heat Sink Compound 0.671W/m.K for Processor CPU

K for Processor CPU. North and South Bridge etc. The surface fixed speed is related to the relative humidity and temperature in the air; the higher the temperature, the faster the curing rate is, the slower the vice versa.

Specification: Item Type: CPU Thermal Paste Material: Silicone Volume: 25g (5 x 5g) Product Shape: White paste Thermal Conductivity: >0.671W/m.k Tear

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Product Description Excellent Performance: high thermal conductivity (10 W/m.K), balanced thermal resistance, and viscosity can keep mushy for a long

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Thermal Paste Silicone Heatsink Cooler for PC Processor CPU

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